High performance silicone room temperature curing adhesive
Thermal conductivity 0.7-1.0 W/m·K
Two component additive silicone rubber
There is no corrosion to copper
Low viscosity, easy operation and application
Low shrinkage, fixed line speed can be controlled by temperature
Flame retardant grade: UL 94-V0
The parameter of solid generation
A / b glue should be mixed evenly according to the ratio of 1:1, and then the pouring operation should be carried out after vacuuming.
Room temperature operating time: 40 min for nt221a and 30 min for nt221b.
Room temperature curing time: 24hrs.
The product can be cured at room temperature for 24 hours. When the room temperature is lower than 20 ℃, the curing speed will be reduced accordingly. If it is necessary to cure rapidly, it can be realized by heating.
Compared with the same kind of famous American brand DOW CORNINX and Japanese famous brand SHINETSX the heat conduction effect is better than the two brands, with excellent performance and affordable price. It is the best choice to pursue quality and reduce production cost.
