Heat dissipation silicone paste is a heat transfer interface material (TIM), which is coated between electronic components such as CPU & GPU, high-power chip, LED lamps, etc. and heat dissipation base to fill the gap, form a good heat conduction channel, reduce the working temperature of the device below the critical point, and prolong the service life of components.

  The thermal conductivity is 0.9 ~ 3.4 W/m·K

       The working temperature range is wide, and the performance is stable at - 50 ℃ - 180 ℃.

       The viscosity is stable, and there will be no viscosity reduction when used for a long time.

       It is not conductive, easy to produce bubbles after use, easy to smear and wipe

Non corrosive, anti-oxidation, will not affect the contact metal, not easy to produce curing.

        Non toxic, tasteless, low flow paste, not easy to cause environmental pollution.

It has passed ROHS, reach and halogen tests.

       Compared with the same kind of famous American brand DOW CORNINX and Japanese famous brand SHINETSX the heat conduction effect is better than the two brands, with excellent performance and affordable price. It is the best choice to pursue quality and reduce production cost.

Email:Kevin_liu@richpowerhk.com